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Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v

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Нийтэлсэн: Өнөөдөр 11:00 Зарын дугаар: 5677637
Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-1 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-2 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-3 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-4 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-5 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-6 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-7 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-8 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-9 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-10 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-11 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-12 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-13 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-14 Samsung m471a1k43eb1-cwe 8gb 1rx8 ddr4 pc4-25600 3200mhz 260 pin 1.2v-15

PROVEN DRAM MODULE SOLUTION IN THE GLOBAL MARKET

Samsung’s memory modules are designed for a wide range of applications to deliver the best performance with low power requirements.

M471A1K43EB1-CWE

Features & Details

•Samsung DDR4 SODIMMs Product Highlights

•8GB SODIMM speed 3200Mhz

•Increase bandwidth by up to 30%

•Reduce power consumption by up to 40% and extend battery life

•Faster burst access speeds for improved sequential data throughput

•Optimized for next-generation processors and platforms

•Available in modules from 8GB up to 32GB

•Total Capacity 8GB (8GB x 1)

SPECIFICATIONS

•Capacity: 8GB

•Memory Type: DDR4

•ECC: Non-ECC

•DIMM Type: SODIMM

•Rank: 1Rx8

•Speed: 3200

•Voltage: 1.2V

•Height: STD

•Qty: 1

•Module Name: PC4-25600S

•Made By: Samsung

•Form Factor: SODIMM

•Width: x64

•Pins: 260-pin

•Depth: 1G

•Chip Size: 8Gb

•Banks: 16 Banks & POD-1.2V

•Organization: x8

•Package: FBGA (Halogen-free & Lead-free, Flip Chip)

•Temperature: Commercial Temp.(0°C ~ 85°C)

•Frequency: 1600

SODIMM: Small Outline DIMM

- Smaller than normal DIMMs - Supports x8 / x16 / up to 2 ranks per DIMM and 2DPC configuration - For systems with limited space issues - Application : Laptop and All in One desktop

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Элссэн огноо 5-р сар, 2018

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